Skills Overview

Top left: Graphic design and information architecture/infographic example. Top middle: Thermal analysis of complex electronics. Top right: Large scale testing, simulating real world strains. Middle left: 3D print example, testing tight tolerance PCB to heatsink interface. Middle: Custom Chinese hot tank testing in E4. Bottom left: CFD simulation which led to patented baffle design. Bottom right: Thermal bench testing of TEC’s and heatsinks. Bottom middle: Sketching and idea mapping example.

  • Creative and analytic problem solver

  • Complex modelling including sheet metal, electronics and surfaces

  • Experience in most manufacturing methods and keen interest in new processes

  • Innovation leadership and NPD process

  • Lifecycle analysis and sustainability

  • DFM DFA and innovative material knowledge

  • Tolerance, industry standards and quality control

  • Multi-disciplinary team collaboration

  • Leadership and mentoring

  • Simulation; CFD, FEA and mould flow

  • Graphic design and high quality rendering

  • Presenting and communication

  • 3D printing and prototyping

  • Technical testing, reporting and researching.

  • BOM’s and ERP system management

  • New technology ambassador

Imaging from upcoming project testing

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Brunel University